Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions
| Line 8: | Line 8: | ||
==HMDS== | ==HMDS== | ||
The chemical treatment with Hexamethyldisilazane (HMDS)before the spin coating can be used to promote the adhesion for photoresist. | The chemical treatment with Hexamethyldisilazane (HMDS) before the spin coating can be used to promote the adhesion for photoresist. | ||
Here is a schematic overview of HMDS treatment of silicon-oxide surface. | The molecular formula for hexamethyldisilazane is C<sub>6</sub>H<sub>19</sub>NSi<sub>2</sub>. Here is a schematic overview of HMDS treatment of silicon-oxide surface. | ||
[[Image:HMDS.jpg|500x500px|thumb|left|Priming of oxide-forming substrates by HMDS treatment.]] | [[Image:HMDS.jpg|500x500px|thumb|left|Priming of oxide-forming substrates by HMDS treatment.]] | ||