Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions

Revision as of 09:00, 31 January 2014 view source Bghe (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators 7,317 edits →Die bonder (eutectic metal soldering) ← Older edit		Revision as of 09:01, 31 January 2014 view source Bghe (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators 7,317 edits →Die bonder (eutectic metal soldering) Newer edit →
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	The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.		The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.


	'''The user manuals, user APVs, technical information and contact information can be found in LabManager:'''		'''The user manuals, user APVs, technical information and contact information can be found in LabManager:'''