Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions

Revision as of 09:00, 31 January 2014

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The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.

The user manuals, user APVs, technical information and contact information can be found in LabManager:

Equipment		Die bonder	Flip-chip bonder
Purpose		Fine placement of dies Eutectic metal soldering	Fine placement of dies glue attachment
Performance		Low thermal resistance Always conducting	Medium or High thermal resistance Possibility of both conducting and isolating adhesives If an epoxy based adhesive is used the user is required to have the epoxy course.
Substrates	Allowed materials	Should be able to withstand the soldering temperature Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)	Any that is compatible with the glue used

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 <!-- give the link to the equipment info page in LabManager: -->
 [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=306 Die Bonder in LabManager]
-http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Die_Bonder
 == Process information ==