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Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions

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The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.  
The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.  


'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''  
'''The user manuals, user APVs, technical information and contact information can be found in LabManager:'''  
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[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=306 Die Bonder in LabManager]
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=306 Die Bonder in LabManager]
http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Die_Bonder
http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Die_Bonder
== Process information ==
== Process information ==


Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder"