Specific Process Knowledge/Thin film deposition/Deposition of Palladium: Difference between revisions
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
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*smaller pieces | *smaller pieces | ||
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| Pre-clean | | Pre-clean | ||
|RF Ar clean | |RF Ar clean | ||
|- | |- | ||
|-style="background:WhiteSmoke; color:black" | |||
| Layer thickness | | Layer thickness | ||
|10Å to 1µm | |10Å to 1µm | ||
|- | |- | ||
|-style="background:silver; color:black" | |||
| Deposition rate | | Deposition rate | ||
|2Å/s to | |2Å/s to 10Å/s | ||
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Revision as of 15:30, 29 January 2014
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Palladium can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | |
|---|---|
| Batch size |
|
| Pre-clean | RF Ar clean |
| Layer thickness | 10Å to 1µm |
| Deposition rate | 2Å/s to 10Å/s |