Specific Process Knowledge/Etch: Difference between revisions
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*A often high etch rate difference of different materials giving raise to a high selectivity of the material to be etched compared to underlaying layers or mask materials. | *A often high etch rate difference of different materials giving raise to a high selectivity of the material to be etched compared to underlaying layers or mask materials. | ||
*Time saving: You can often etch 25 wafers at a time in wet chemistry where as dry etch equipment can only handle one wafer at a time. | *Time saving: You can often etch 25 wafers at a time in wet chemistry where as dry etch equipment can only handle one wafer at a time. | ||
*High flexibility with regards to ... | |||
'''Advantages of dry etch over wet chemistry:''' | '''Advantages of dry etch over wet chemistry:''' | ||