Specific Process Knowledge/Characterization/XPS: Difference between revisions
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!style="background:silver; color:black" align="left"|Depth profiling | !rowspan="2" style="background:silver; color:black" align="left"|Depth profiling | ||
|style="background:LightGrey; color:black"|Purpose | |style="background:LightGrey; color:black"|Purpose | ||
|style="background:WhiteSmoke; color:black"|With ion beam etch the top layer of the material can be removed, to do a depth profiling | |style="background:WhiteSmoke; color:black"|With ion beam etch the top layer of the material can be removed, to do a depth profiling | ||
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|style="background:LightGrey; color:black"|Ion beam size | |style="background:LightGrey; color:black"|Ion beam size | ||
|style="background:WhiteSmoke; color:black"| About 0,3x1 mm | |style="background:WhiteSmoke; color:black"| About 0,3x1 mm | ||
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!style="background:silver; color:black" align="left"|Substrates | !rowspan="2" style="background:silver; color:black" align="left"|Substrates | ||
|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
Max 60x60 mm | Max 60x60 mm | ||
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| style="background:LightGrey; color:black"|Substrate thickness | | style="background:LightGrey; color:black"|Substrate thickness | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||