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Specific Process Knowledge/Characterization/XPS: Difference between revisions

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Knil (talk | contribs)
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* Depth profiling possible by ion beam etch of sample
* Depth profiling possible by ion beam etch of sample
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!style="background:silver; color:black" align="left"||rowspan="5"| Performance
!rowspan="5" style="background:silver; color:black" align="left"| Performance
|style="background:LightGrey; color:black"|Spot size
|style="background:LightGrey; color:black"|Spot size
|style="background:WhiteSmoke; color:black"|Can be set between 30µm - 400µm
|style="background:WhiteSmoke; color:black"|Can be set between 30µm - 400µm
   
   
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|style="background:LightGrey; color:black"|Probing depth  
|style="background:LightGrey; color:black"|Probing depth  
|style="background:WhiteSmoke; color:black"|Depending on probed element. Max probe depth lies within 10-200 Å.  
|style="background:WhiteSmoke; color:black"|Depending on probed element. Max probe depth lies within 10-200 Å.  
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|style="background:LightGrey; color:black"|Resolution
|style="background:LightGrey; color:black"|Resolution
|style="background:WhiteSmoke; color:black"|Dependent on probed elements. Concentrations down to about 0,5 atomic % can in some cases be detected.  
|style="background:WhiteSmoke; color:black"|Dependent on probed elements. Concentrations down to about 0,5 atomic % can in some cases be detected.  
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|style="background:LightGrey; color:black"|Charge compensation  
|style="background:LightGrey; color:black"|Charge compensation  
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Flood gun can be used for charge compensation of non conductive samples
Flood gun can be used for charge compensation of non conductive samples
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|style="background:silver; color:black"|
|style="background:LightGrey; color:black"|Finding structures
|style="background:LightGrey; color:black"|Finding structures
|style="background:WhiteSmoke; color:black"|Choose measuring spot from camera image (magnified)
|style="background:WhiteSmoke; color:black"|Choose measuring spot from camera image (magnified)