Specific Process Knowledge/Wafer and sample drying/Critical Point Dryer: Difference between revisions
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==Critical Point Dryer== | ==Critical Point Dryer== | ||
[[Image:CPD.JPG|300x300px|thumb|Critical point dryer: positioned in cleanroom | [[Image:CPD.JPG|300x300px|thumb|Critical point dryer: positioned in cleanroom D-3.]] | ||
The critical point dryer is used to dry fragile structures that may be damaged in a normal drying procedure. Fragile structures may be thin membranes, or free hanging structures like cantilevers and grippers. | The critical point dryer is used to dry fragile structures that may be damaged in a normal drying procedure. Fragile structures may be thin membranes, or free hanging structures like cantilevers and grippers. | ||
'''The user manual(s), technical information and contact information can be found in LabManager:''' | |||
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[http://http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=254 Critical Point Dryer in LabManager] | |||
In the critical point dryer, these structures are dried in CO<math>_2</math>. In the drying process, the sample is first put into Isopropanol, and loaded into the machine. In the process itself, the isopropanol is exchanged for liquid CO<math>_2</math>. When there is only CO<math>_2</math> in the machine, the pressure and temperature in the chamber is raised, above the so called “critical point”. In this way, there is never a liquid/gas interface, but instead the liquid is turned into a mixture of equal parts of gas and liquid. Because of this, the problem with surface tension, which destroys the fragile structures through capillary forces, is avoided. | In the critical point dryer, these structures are dried in CO<math>_2</math>. In the drying process, the sample is first put into Isopropanol, and loaded into the machine. In the process itself, the isopropanol is exchanged for liquid CO<math>_2</math>. When there is only CO<math>_2</math> in the machine, the pressure and temperature in the chamber is raised, above the so called “critical point”. In this way, there is never a liquid/gas interface, but instead the liquid is turned into a mixture of equal parts of gas and liquid. Because of this, the problem with surface tension, which destroys the fragile structures through capillary forces, is avoided. | ||
==Equipment performance and process related parameters== | |||
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