Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions
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| | |[[/Stress Wordentec Ni films|Stress in Wordentec Ni films: study here]]. | ||
|Only very thin layers (up to 100nm). | |Only very thin layers (up to 100nm). | ||
|Sample must be compatible with plating bath. Seed metal necessary. | |Sample must be compatible with plating bath. Seed metal necessary. | ||
Revision as of 09:21, 27 January 2014
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Nickel deposition
Nickel can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Wordentec) | E-beam evaporation (PVD co-sputter/evaporation) | Electroplating (Electroplating-Ni) | |
|---|---|---|---|---|
| Batch size |
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|
|
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| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean | None |
| Layer thickness | 10Å to 1µm | 10Å to 1 µm | 10Å to 1000 Å | A few µm to 1400 µm |
| Deposition rate | 2Å/s to 15Å/s | 10Å/s to 15Å/s | About 1Å/s | About 10 to 250 Å/s |
| Comment | Stress in Wordentec Ni films: study here. | Only very thin layers (up to 100nm). | Sample must be compatible with plating bath. Seed metal necessary. |