Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions
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<!-- give the link to the equipment info page in LabManager: --> | <!-- give the link to the equipment info page in LabManager: --> | ||
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=306 Die Bonder in LabManager] | [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=306 Die Bonder in LabManager] | ||
http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Die_Bonder | |||
== Process information == | == Process information == | ||
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== Flip-chip bonder (glue attachment) == | == Flip-chip bonder (glue attachment) == | ||
[[image: | [[image:Flip_chip_Bonder_dr_Tresky.jpg|200x200px|right|thumb|The Flip chip bonder]] | ||
<!-- give the link to the equipment info page in LabManager: --> | <!-- give the link to the equipment info page in LabManager: --> | ||