Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions

Revision as of 14:25, 24 January 2014

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Die bonder (eutectic metal soldering)

The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

Die Bonder in LabManager http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Die_Bonder

Process information

Au-Sn eutectic die bonding

Flip-chip bonder (glue attachment)

Flip-chip Bonder in LabManager (not there yet)

Equipment performance and process related parameters

Equipment		Die bonder	Flip-chip bonder
Purpose		Fine placement of dies Eutectic metal soldering	Fine placement of dies glue attachment
Performance		Low thermal resistance Always conducting	Medium or High thermal resistance Possibility of both conducting and isolating adhesives If an epoxy based adhesive is used the user is required to have the epoxy course.
Substrates	Allowed materials	Should be able to withstand the soldering temperature Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)	Any that is compatible with the glue used

@@ Line 13: / Line 13: @@
 <!-- give the link to the equipment info page in LabManager: -->
 [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=306 Die Bonder in LabManager]
+http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Die_Bonder
 == Process information ==
@@ Line 20: / Line 20: @@
 == Flip-chip bonder (glue attachment) ==
-[[image:Flip chip Bonder dr Tresky.jpg|200x200px|right|thumb|The Flip chip bonder]]
+[[image:Flip_chip_Bonder_dr_Tresky.jpg|200x200px|right|thumb|The Flip chip bonder]]
 <!-- give the link to the equipment info page in LabManager: -->