Jump to content

Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions

← Older editNewer edit →
VisualWikitext
Jehan (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891, Bureaucrats, danchip, Administrators
1,093 edits
mNo edit summary
Kabi (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
1,146 edits
Line 20: Line 20:
== Flip-chip bonder (glue attachment) ==
== Flip-chip bonder (glue attachment) ==


[[image:flip-chip-bonder.jpg|200x200px|right|thumb|The Flip-chip bonder (picture coming soon)]]
[[image:Flip chip Bonder dr Tresky.jpg|200x200px|right|thumb|The Flip-chip bonder (picture coming soon)]]


<!-- give the link to the equipment info page in LabManager: -->
<!-- give the link to the equipment info page in LabManager: -->
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder"