Specific Process Knowledge/Thin film deposition/MVD: Difference between revisions

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!style="background:silver; color:black;" align="center" width="60"|Vapor sources  
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Revision as of 12:37, 20 January 2014

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The Molecular Vapor Deposition tool

The MVD is located in cleanroom 1

The Applied Microstructures MVD 100 system deposits molecular films on surfaces. These films serve a wide range of purposes ranging from antistiction coatings of nanoimprint lithography stamps to protecting MEMS structures. At Danchip the MVD is an essential tool for nanoimprint lithography, where it is used to create antistiction coatings on the imprint stamps.

The user manual, user APV, and contact information can be found in LabManager

Process information

Equipment performance and process related parameters

Purpose
  • FDTS coating of Si or SiO2 surfaces
  • Indirect O2 plasma treatment
Vapor sources Line
  • 1
  • 2
  • 3
  • 4
Chemical
  • Water
  • FDTS (new source)
  • FDTS (old source, contaminated line)
  • Available (line probably contaminated)
Performance Contact angle

110° (water)

Process parameters Base pressure

20 mTorr

Chamber temperature

35°C

Chamber volume

Approx. 3 liters

Substrates Substrate size

1" to 8"

Smaller samples may be processed if fixed to a carrier

Allowed materials

All cleanroom materials

Batch

One sample at a time

Two 4" or 6" wafers may be processed simultaneously using cassettes