Specific Process Knowledge/Thin film deposition/MVD: Difference between revisions
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=== Equipment performance and process related parameters === | === Equipment performance and process related parameters === | ||
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!style="background:silver; color:black;" align="center" width="60"|Purpose | |||
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|style="background:WhiteSmoke; color:black"| | |||
*Spin coating and soft baking UV sensative resists | |||
*Spin coating SU8 resists | |||
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!style="background:silver; color:black;" align="center" width="60"|Resist | |||
|style="background:LightGrey; color:black"| | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
* AZ5214E permanent line | |||
* AZ4562 manual dispense | |||
* SU8 resists manual dispense | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | |||
|style="background:LightGrey; color:black"|Coating thickness | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
* AZ5214E 1-4,2 µm | |||
* AZ4526 6,2-10 µm | |||
* SU8 resits 0,1-100 µm | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters | |||
|style="background:LightGrey; color:black"|Spin speed | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
100 - 5000 rpm | |||
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|style="background:LightGrey; color:black"|Spin acceleration | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
100 - 5000 rpm/s | |||
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|style="background:LightGrey; color:black"|Hotplate temperature | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
* changeable temperature from 20° to 200° | |||
* SU8 must be bake out on SU8 dedicated hotplates | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | |||
|style="background:LightGrey; color:black"|Substrate size | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
* 50 mm wafers | |||
* 100 mm wafers | |||
* 150 mm wafers | |||
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| style="background:LightGrey; color:black"|Allowed materials | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
All cleanroom materials except III-V materials | |||
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|style="background:LightGrey; color:black"|Batch | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
1 | |||
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