Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions
No edit summary |
|||
| Line 2: | Line 2: | ||
==Thickness measurer== | ==Thickness measurer== | ||
[[Image:Thicknessmeasurer2007.jpg|thumb|300x300px| | [[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Thickness Measurer. Positioned in cleanroom 4]] | ||
The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas. | The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas. | ||
Revision as of 11:20, 15 January 2014
Feedback to this page: click here
Thickness measurer
The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.
The user manual, technical information and contact information can be found in LabManager:
Quality Control - Recipe Parameters and Limits
| Quality Control (QC) for the Thickness measurer |
|
The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year. |
|
Purpose |
Thickness measurer |
|
|---|---|---|
|
Performance |
Thickness resolution |
|
|
Substrates |
Batch size |
|
| Substrate materials allowed |
|