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Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Pevo (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
2,331 edits
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The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.  
The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.  


Doing a KOH etch can it be helpful to ensure no over-etching by making a thickness measurement during the etching.
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.


'''The user manual, technical information and contact information can be found in LabManager:'''
'''The user manual, technical information and contact information can be found in LabManager:'''
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