Revision as of 11:17, 15 January 2014

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The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.

Doing a KOH etch can it be helpful to ensure no over-etching by making a thickness measurement during the etching.

The user manual, technical information and contact information can be found in LabManager:

Quality Control (QC) for the Thickness measurer

The measured standard thickness is 0.1 mm. The measured result have to be within ± 0.005 mm. The QC is preformed ones a year.

Purpose	Thickness measurer	Wafer thickness Depths of larger grooves Heigth of larger mesas
Performance	Thickness resolution	< 5 µm
Process pressure	1 atm
Substrates	Batch size	One sample
Substrates	Substrate materials allowed	No restrictions

@@ Line 35: / Line 35: @@
 Thickness measurer
 |style="background:WhiteSmoke; color:black"|
-*Wafer
+*Wafer thickness
 *Depths of larger grooves
 *Heigth of larger mesas
@@ Line 44: / Line 44: @@
 Thickness resolution
 |style="background:WhiteSmoke; color:black"|
-*>5 µm
+*< 5 µm
-|-
-!style="background:silver; color:black" align="center" valign="center" rowspan="2"|
-Process parameter range
-|style="background:LightGrey; color:black"|
-Process Temperature
-|style="background:WhiteSmoke; color:black"|
-*Room temperature
 |-
 |style="background:LightGrey; color:black"|Process pressure
@@ Line 66: / Line 59: @@
 | style="background:LightGrey; color:black"|Substrate materials allowed
 |style="background:WhiteSmoke; color:black"|
-*No restriction.
+*No restrictions
 |-
 |}