Revision as of 11:13, 15 January 2014

THIS PAGE IS UNDER CONSTRUCTION

Feedback to this page: click here

The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.

Doing a KOH etch can it be helpful to ensure no over-etching by making a thickness measurement during the etching.

The user manual, technical information and contact information can be found in LabManager:

Quality Control (QC) for the Thickness measurer

The measured standard thickness is 0.1 mm. The measured result have to be within ± 0.005 mm. The QC is preformed ones a year.

Purpose	Thickness measurer	Wafer Depths of larger grooves Heigth of larger mesas
Performance	Thickness resolution	>5 µm
Process parameter range	Process Temperature	Room temperature
Process parameter range	Process pressure	1 atm
Substrates	Batch size	One sample
Substrates	Substrate materials allowed	No restriction.

@@ Line 9: / Line 9: @@
 The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.
-Doing a KOH etch can it be helpful to insure no over etching by making a thickness measurement doing the etch.
+Doing a KOH etch can it be helpful to ensure no over-etching by making a thickness measurement during the etching.
 '''The user manual, technical information and contact information can be found in LabManager:'''