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Thickness measurer

The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.

Doing a KOH etch can it be helpful to insure no over etching by making a thickness measurement doing the etch.

The user manual, technical information and contact information can be found in LabManager:

Thickness measurer

Quality Control - Recipe Parameters and Limits

Quality Control (QC) for the Thickness measurer

The measured standard thickness is 0.1 mm. The measured result have to be within ± 0.005 mm. The QC is preformed ones a year.

Equipment performance and process related parameters

Purpose	Thickness measurer	Wafer Depths of larger grooves Heigth of larger mesas
Performance	Thickness resolution	>5 µm
Process parameter range	Process Temperature	Room temperature
Process parameter range	Process pressure	1 atm
Substrates	Batch size	One sample
Substrates	Substrate materials allowed	No restriction.

@@ Line 5: / Line 5: @@
 ==Thickness measurer==
-[[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Thickness meassurer. Positioned in cleanroom 4]]
+[[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Digital Thickness Measurer. Positioned in cleanroom 4]]
 The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.
 Doing a KOH etch can it be helpful to insure no over etching by making a thickness measurement doing the etch.
-We have two Thickness measures an analog and a digital one.
 '''The user manual, technical information and contact information can be found in LabManager:'''
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 |bgcolor="#98FB98" |'''Quality Control (QC) for the Thickness measurer'''
 |-
 |
+The measured standard thickness is 0.1 mm. The measured result have to be within &plusmn; 0.005 mm. The QC is preformed ones a year.
 *[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach=198 The QC procedure]<br>
 *[http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=2062 The newest QC data]<br>
-The measured standard thickness is 0.1 mm. The measured result have to be within +- 0.005 mm. The QC is preformed ones a year.
 |}
 ==Equipment performance and process related parameters==
-{| border="2" cellspacing="2" cellpadding="0"
+{| border="2" cellspacing="2" cellpadding="3"
 |-
 !style="background:silver; color:black;" align="center"|
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 |-
 |}
-'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Thickness_Measurer click here]'''
-This is a micrometer-screw.
-[[image:Mikrometerskrue_hel_a.JPG|200x200px|right|thumb|The Thickness measurer in Cleanroom 3 ]]
-It measures with an accurracy within a few µm.
-The range is from a few µm up to 5mm.
-Measure the wafer in the box next to the meter. If this is ok, then other wafers can be measured.
-There is a calibration device by the DEKTAK.
-It is calibrated at 750µm.