Specific Process Knowledge/Thermal Process/Furnace Noble: Difference between revisions

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==Overview of the performance of the Noble Furnace==
==Overview of the performance of the Noble Furnace==


{| border="2" cellspacing="0" cellpadding="0"  
{| border="2" cellspacing="0" cellpadding="2"  
|-
|-
!style="background:silver; color:black;" align="center"|Purpose  
!style="background:silver; color:black;" align="center"|Purpose  
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Oxidation:
Oxidation:
*Dry
*Dry
*Wet (with bubbler)
*Wet (with bubbler. water steam + N<sub>2</sub>)
Annealing:
Annealing:
*N<sub>2</sub>:
*N<sub>2</sub>
*Argon
*Argon
|-
|-
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|style="background:LightGrey; color:black"|Gasses on the system
|style="background:LightGrey; color:black"|Gasses on the system
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*N<sub>2</sub>:0-5 SLM
*N<sub>2</sub>: 0-5 SLM
*O<sub>2</sub>: 0-5 SLM
*O<sub>2</sub>: 0-5 SLM
*Argon: 0-7 SLM
*Argon: 0-7 SLM
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1-25 100 mm wafers (or 50 mm wafers) per run
*1-25 100 mm wafers (or 50 mm wafers) per run
*A number of smaller samples (placed on a Si carrier wafer)
|-
|-
| style="background:LightGrey; color:black"|Substrate material allowed
| style="background:LightGrey; color:black"|Substrate material allowed

Revision as of 11:40, 14 January 2014

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Noble furnace

The Noble Furnace is mostly used for annealing and oxidation of different samples. Annealing can be done in a nitrogen or argon atmosphere. Recently (Autumn 2013) a bubler has also been installed in the furnace, so it is possible to do both wet and dry oxidations. The maximum temperature of the furnace is 1000 oC.

In the Noble Furnaces more dirty samples with metals and some specific polymers are allowed. Different sample holder are available for wafers and smaller samples.

The furnace is located in service area 3.

Noble furnace. Positioned in service area 3

The user manual, technical information and contact information can be found in LabManager:

Noble furnace

Overview of the performance of the Noble Furnace

Purpose
  • Oxidation
  • Annealing

Oxidation:

  • Dry
  • Wet (with bubbler. water steam + N2)

Annealing:

  • N2
  • Argon
Process parameter range Process Temperature
  • Up to 1000 oC
Process pressure
  • 1 atm
Gasses on the system
  • N2: 0-5 SLM
  • O2: 0-5 SLM
  • Argon: 0-7 SLM
Substrates Batch size
  • 1-25 100 mm wafers (or 50 mm wafers) per run
  • A number of smaller samples (placed on a Si carrier wafer)
Substrate material allowed
  • Silicon samples (new from the box or RCA cleaned)
  • Silicon samples with metals
  • Silicon sample with polymers (only approved materials)
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