Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions
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==Thickness measurer== | ==Thickness measurer== | ||
[[Image: | [[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Thickness meassurer. Positioned in cleanroom 4]] | ||
The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas. | The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas. | ||
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'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=198 Thickness measurer]''' | '''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=198 Thickness measurer]''' | ||
==Quality Control - Recipe Parameters and Limits== | ==Quality Control - Recipe Parameters and Limits== |
Revision as of 13:46, 13 January 2014
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Thickness measurer
The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.
Doing a KOH etch can it be helpful to insure no over etching by making a thickness measurement doing the etch.
The user manual, technical information and contact information can be found in LabManager:
Quality Control - Recipe Parameters and Limits
Quality Control (QC) for the Thickness measurer |
The measured standard thickness is 0.1 mm. The measured result have to be within +- 0.005 mm. The QC is preformed ones a year. |
Purpose |
Thickness measurer |
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Performance |
Thickness within |
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Process parameter range |
Process Temperature |
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Process pressure |
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Substrates |
Batch size |
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Substrate materials allowed |
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This is a micrometer-screw.
It measures with an accurracy within a few µm. The range is from a few µm up to 5mm. Measure the wafer in the box next to the meter. If this is ok, then other wafers can be measured. There is a calibration device by the DEKTAK. It is calibrated at 750µm.