Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions
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| 50 µm | | 50 µm | ||
| [[media:TB_1064nm_255mm_cutting_Si_Si3N4.xls|Silicon nitride cutting parameters]] | | [[media:TB_1064nm_255mm_cutting_Si_Si3N4.xls|Silicon nitride cutting parameters]] | ||
| Samples can easily be removed with a soft mechanical pressure. A layer of resist can be deposited on the top without influenced the dicing. | | Samples can easily be removed with a soft mechanical pressure. A layer of resist can be deposited on the top without influenced the dicing. Thicker layers (oxyde or nitride) have not been tested. | ||
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|- style="background:LightGray;text-align:center" valign="top" | |- style="background:LightGray;text-align:center" valign="top" | ||