Specific Process Knowledge/Characterization/Profiler: Difference between revisions
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The main purpose is 3D topographic imaging of surfaces, step height measurements in smaller trenches/holes than can be obtained with standard stylus methods, roughness measurements with larger FOV (Field Of View) than the AFM, but less horisontal resolution. | The main purpose is 3D topographic imaging of surfaces, step height measurements in smaller trenches/holes than can be obtained with standard stylus methods, roughness measurements with larger FOV (Field Of View) than the AFM, but less horisontal resolution. | ||
'''The user manual, technical information and contact information can be found in LabManager:''' | |||
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=301 RIE2 info page in LabManager] | |||