Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions
| Line 143: | Line 143: | ||
| 4 | | 4 | ||
| 50 µm | | 50 µm | ||
| [[media: | | [[media:TB_1064nm_255mm_cutting_Si_Si3N4.xls|Silicon nitride cutting parameters]] | ||
| Samples can easily be removed with a soft mechanical pressure. A layer of resist can be deposited on the top without influenced the dicing. | | Samples can easily be removed with a soft mechanical pressure. A layer of resist can be deposited on the top without influenced the dicing. | ||
|- | |- | ||