Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions
| Line 144: | Line 144: | ||
| 50 µm | | 50 µm | ||
| [[media:Dicing_Si_Si3N4_1064nm_f255mm.xls|Silicon nitride cutting parameters]] | | [[media:Dicing_Si_Si3N4_1064nm_f255mm.xls|Silicon nitride cutting parameters]] | ||
| Samples can easily be removed with a soft mecanical pressure. A layer of resist | | Samples can easily be removed with a soft mecanical pressure. A layer of resist can be deposited on the top without influence the dicing. | ||
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|- style="background:LightGray;text-align:center" valign="top" | |- style="background:LightGray;text-align:center" valign="top" | ||