Specific Process Knowledge/Thermal Process/C4 Aluminium Anneal furnace: Difference between revisions
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| style="background:LightGrey; color:black"|Substrate materials allowed | | style="background:LightGrey; color:black"|Substrate materials allowed | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Silicon wafers with | *Silicon wafers with aluminium. | ||
*Wafers are allowed enter the furnace after aluminium lift-off or after aluminium etch and resist strip in acetone | *Wafers are allowed enter the furnace after aluminium lift-off or after aluminium etch and resist strip in acetone | ||
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