Specific Process Knowledge/Thermal Process/C3 Anneal-bond furnace: Difference between revisions
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This furnace is the third furnace tube in the furnace C-stack positioned in cleanroom 2. | This furnace is the third furnace tube in the furnace C-stack positioned in cleanroom 2. | ||
In this furnace it is allowed oxidize and anneale wafers without doing a RCA clean first. Also bonded wafers comming directly from the EVG NIL (assuming they were | In this furnace it is allowed oxidize and anneale wafers without doing a RCA clean first. Also bonded wafers comming directly from the EVG NIL (assuming they were clean and not contain any metal when entering EVG NIL). Check the cross contamination information in LabManager. | ||
'''The user manual, technical information and contact information can be found in LabManager:''' | '''The user manual, technical information and contact information can be found in LabManager:''' | ||