Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions
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| Increase/decrease the number of iteration to increase/decrease the width of the hole. [[file:pyrex_10um_hole_chanel.jpg|Microscope view of the chanel ]] | | Increase/decrease the number of iteration to increase/decrease the width of the hole. [[file:pyrex_10um_hole_chanel.jpg|Microscope view of the chanel ]] | ||
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|- style="background:LightGray" valign="top" | |||
| Pyrex/Borosilicate glass (525µm) | |||
| Red(1064nm/255mm) | |||
| 200 kHz | |||
| 100% | |||
| 2,96 W | |||
| 1000 mm/s | |||
| 1 burst | |||
| 4 (-0,1/-0,2/-0,3/-0,4mm) | |||
| 300/500/700/900/1200 | |||
| 4 | |||
| 20 µm | |||
| [[media:Cutting_Pyrex_microfluidic_hole_1064nm_255mm.xls|Cutting Pyrex 1000µm for microfluidic hole parameters]] | |||
| Increase/decrease the number of iteration to increase/decrease the width of the hole. [[file:pyrex_10um_hole_chanel.jpg|Microscope view of the chanel ]] | |||
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