Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions
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| Easily break silicon in cristal plan. Depth of the groove : 25µm | | Easily break silicon in cristal plan. Depth of the groove : 25µm | ||
|- style="background:LightGray" valign="top" | |- style="background:LightGray" valign="top" | ||
| Silicon with SiO2 | | Silicon 525µm with SiO2 (150nm to 1,2µm) | ||
| Red (1064nm/255mm) | | Red (1064nm/255mm) | ||
| 200 kHz | | 200 kHz | ||
Revision as of 15:58, 7 January 2014
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Laser Micromachining Tool 
The Laser Micromachining Tool is a microSTRUCT vario from the company 3D-Micromac AG.
The system is able to produce micro structures in different kinds of materials like metals, ceramics, composite materials, etc.
The machine is located in the basement of building 346 under the cleanroom.
The user manual(s), user APV(s), technical information and contact information can be found in LabManager:
The Laser Micromachining Tool in LabManager
It is equipped with 2 high power lasers:
- a 50W picosecond laser that can emit light at 3 wavelengths: 355nm, 532nm and 1064nm and a
- a 100W nanosecond laser with a wavelength of 1064nm.
It consist of these main parts:
- Upper service way
- Manual front door
- Operating panel
- Machine's feet (adjustable)
- Left service way
- Electrical cabinet
Process information
- Silicon cutting and milling
- Borofloat glass cutting and milling
- Quartz cutting and milling
- Nickel cutting and milling (for Polymer Injection Molder)
- Mask making
Laser Processing details
| Material | Pattern | Optics | Frequency | Intensity | Writing speed | Other | Parameter file |
| Silicon | Red (1064nm/255mm) | 100% | ?? mm/s | silicon cutting.par | |||
| Silicon with SiliconNitride | Red (1064nm/255mm) | 100% | ?? mm/s | silicon-SiN cutting.par | |||
| Borofloat glass | Red (1064nm/255mm) | 100% | ?? mm/s | borofloat cutting.par | |||
| Nickel | Red (1064nm/255mm) | 100% | ?? mm/s | nickel cutting red.par | |||
| Nickel | "wafer" 85mm diameter | Green (532nm/255mm) | 200 kHz | 100% | 300 mm/s | Fixed Burst mode, 3 pulses. Sky writing mode 3. | nickel cutting green parameters |
| Mask making | Blue (355nm/103mm) | 20% | ?? mm/s | mask making.par |
| Material | Optics | Frequency | Intensity | Power measured @10% | Writing speed | Number of burst | Number of Z-offset | Number of iteration | Number of parallel lines | Gap in between line | Parameter file | Comments |
| Silicon 525µm | Green(532nm/255mm) | 200 kHz | 100% | 0,57 W | 50 mm/s | 1 burst | none | 4 it. | 1 | N/A | Silicon dicing green parameters | Easily break silicon in cristal plan. Depth of the groove : 25µm |
| Silicon 525µm with SiO2 (150nm to 1,2µm) | Red (1064nm/255mm) | 200 kHz | 100% | 2,8 W | 1000 mm/s | 3 bursts | 1 (-0,3mm) | 350/100 | 4 | 50 µm | Silicon nitride cutting parameters | Samples can easily be removed with a soft mecanical pressure. A layer of resist (AZMIR701) can be deposited on the top without influence the dicing. However, the burnt resist may induce cracks that can propagate, under the influence of the number of iteration. The blue tape may sticks to the wafer a the end of the process. |
The parameter filename extension is here set to .doc because of MediaWiki restrictions. The 3DMM laser software uses .par as parameter file extension. The file should be a pure text-file with no formatting codes etc.