Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions

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| align="left" valign="top" style="background:LightGray"|''' Material'''
| align="left" valign="top" style="background:LightGray"|''' Material'''
| align="left" valign="top" style="background:LightGray"|''' Pattern'''
| align="left" valign="top" style="background:LightGray"|''' Pattern'''
| align="left" valign="top" style="background:LightGray"|''' Number of parallel lines'''
| align="left" valign="top" style="background:LightGray"|''' Gap in between line [µm]'''
| align="left" valign="top"  style="background:LightGray"|''' Optics'''
| align="left" valign="top"  style="background:LightGray"|''' Optics'''
| align="left" valign="top" style="background:LightGray"|''' Frequency'''
| align="left" valign="top" style="background:LightGray"|''' Frequency'''
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| Silicon
| Silicon
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|  
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| Red (1064nm/255mm)
| Red (1064nm/255mm)
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| Silicon with SiliconNitride
| Silicon with SiliconNitride
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| Red (1064nm/255mm)
| Red (1064nm/255mm)
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| ?? mm/s
| ?? mm/s
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| [[silicon cutting.par]]
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Revision as of 15:28, 7 January 2014

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Laser Micromachining Tool

Lasertool microSTRUCT vario (3D-Micromac AG)
Inside lasertool

The Laser Micromachining Tool is a microSTRUCT vario from the company 3D-Micromac AG.

The system is able to produce micro structures in different kinds of materials like metals, ceramics, composite materials, etc.

The machine is located in the basement of building 346 under the cleanroom.

The user manual(s), user APV(s), technical information and contact information can be found in LabManager:

The Laser Micromachining Tool in LabManager

It is equipped with 2 high power lasers:

  • a 50W picosecond laser that can emit light at 3 wavelengths: 355nm, 532nm and 1064nm and a
  • a 100W nanosecond laser with a wavelength of 1064nm.

It consist of these main parts:

  • Upper service way
  • Manual front door
  • Operating panel
  • Machine's feet (adjustable)
  • Left service way
  • Electrical cabinet

Process information

Laser Processing details

Material Pattern Optics Frequency Intensity Writing speed Other Parameter file
Silicon Red (1064nm/255mm) 100% ?? mm/s silicon cutting.par
Silicon with SiliconNitride Red (1064nm/255mm) 100% ?? mm/s silicon-SiN cutting.par
Borofloat glass Red (1064nm/255mm) 100% ?? mm/s borofloat cutting.par
Nickel Red (1064nm/255mm) 100% ?? mm/s nickel cutting red.par
Nickel "wafer" 85mm diameter Green (532nm/255mm) 200 kHz 100% 300 mm/s Fixed Burst mode, 3 pulses. Sky writing mode 3. nickel cutting green parameters
Mask making Blue (355nm/103mm) 20% ?? mm/s mask making.par


Material Pattern Number of parallel lines Gap in between line [µm] Optics Frequency Intensity Writing speed Other Parameter file
Silicon Red (1064nm/255mm) 100% ?? mm/s silicon cutting.par
Silicon with SiliconNitride Red (1064nm/255mm) 100% ?? mm/s silicon cutting.par



The parameter filename extension is here set to .doc because of MediaWiki restrictions. The 3DMM laser software uses .par as parameter file extension.
The file should be a pure text-file with no formatting codes etc.