Specific Process Knowledge/Thin film deposition/Wordentec: Difference between revisions
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*[http://labmanager.danchip.dtu.dk/d4Show.php?id= | *[http://labmanager.danchip.dtu.dk/d4Show.php?id=1404&mach=167 QC procedure for Wordentec]<br> | ||
*[http://labmanager.danchip.dtu.dk/view_binary.php?fileId=2064 The newest QC data for | *[http://labmanager.danchip.dtu.dk/view_binary.php?fileId=2064 The newest QC data for Wordentec]<br> | ||
{| {{table}} | {| {{table}} | ||
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! QC Recipe: | ! QC Recipe: | ||
! Au | ! Au | ||
! Ni | |||
|- | |- | ||
|Deposition rate | |Deposition rate | ||
|10 Å/s | |||
|10 Å/s | |10 Å/s | ||
|- | |- | ||
|Thickness | |Thickness | ||
|1000 Å | |||
|1000 Å | |1000 Å | ||
|- | |- | ||
|Pressure | |Pressure | ||
|Below 2*10<sup>-6</sup> | |Below 2*10<sup>-6</sup> | ||
|Below 2*10<sup>-6</sup> | |||
|- | |- | ||
|} | |} | ||