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Specific Process Knowledge/Back-end processing: Difference between revisions

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Jehan (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891, Bureaucrats, danchip, Administrators
1,093 edits
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*[[/Borofloat cutting and milling|Borofloat glass (Pyrex)]]
*[[/Borofloat back-end process|Borofloat glass (Pyrex)]]
*[[/Quartz cutting and milling|Fused silica (quartz)]]
*[[/Quartz back-end process|Fused silica (quartz)]]
|style="background: #DCDCDC"|
|style="background: #DCDCDC"|
*[[/Silicon cutting and milling|Silicon]]
*[[/Silicon back-end process|Silicon]]
*[[/III-V lapping|III-V]]
*[[/III-V lapping|III-V]]
|style="background: LightGray"|
|style="background: LightGray"|
*[[/Aluminium cutting and milling|Aluminium]]
*[[/Aluminium back-end process|Aluminium]]
*[[/Nickel cutting and milling|Nickel]]
*[[/Nickel back-end process|Nickel]]
*[[/Steel cutting and milling|Steel]]
*[[/Steel back-end process|Steel]]
|style="background: LightGray"|
|style="background: LightGray"|
*[[/PMMA cutting and milling|PMMA]]
*[[/PMMA back-end process|PMMA]]
*[[/TOPAS cutting and milling|TOPAS]]
*[[/TOPAS back-end process|TOPAS]]
*[[/Polystyrene cutting and milling|Polystyrene]]
*[[/Polystyrene back-end process|Polystyrene]]
*[[/Polycarbonate cutting and milling|Polycarbonate]]
*[[/Polycarbonate back-end process|Polycarbonate]]
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