Specific Process Knowledge/Back-end processing: Difference between revisions
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**[[/Focal Spot X-ray system|Focal Spot X-ray system]] | **[[/Focal Spot X-ray system|Focal Spot X-ray system]] | ||
== Choose processing method == | |||
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| align="left" valign="top" style="background:LightGray"|''' Lapping/polishing''' | |||
| align="left" valign="top" style="background:LightGray"|''' Cutting''' | |||
| align="left" valign="top" style="background:#DCDCDC;"|''' Milling''' | |||
| align="left" valign="top" style="background:LightGray"|''' Die bonding''' | |||
| align="left" valign="top" style="background:LightGray"|''' Wire bonding''' | |||
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*[[/Polishing machine|Polisher/Lapper machine]] | |||
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*[[/Wafer Scriber|Wafer Scriber]] | |||
*[[/Disco Saw|Disco Saw]] | |||
*[[/Laser Micromachining Tool|Laser Micromachining Tool]] | |||
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*[[/Laser Micromachining Tool|Laser Micromachining Tool]] | |||
*[http://portalen.dtu.dk/Institutter/DTU_Nanotech.aspx Nanotech milling lab] | |||
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*[[/Die Bonder|Die Bonder (eutectic metal)]] | |||
*[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]] | |||
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*[[/Wire Bonder|TPT Wire Bonder]] | |||
*[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]] | |||
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== Choose material to be processed == | == Choose material to be processed == | ||
{| {{table}} | {| {{table}} | ||