Specific Process Knowledge/Back-end processing: Difference between revisions

Revision as of 15:19, 6 December 2013

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Back-end Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out outside the clean room.

Choose an equipment

Chip/die mounting
- Die Bonder (eutectic metal)
- Flip-chip Bonder (glue)
Wire bonding
- TPT Wire Bonder
- Ball Wire Bonder
Wafer dicing/machining
Molding
- Polymer Injection Molder
X-ray inspection system
- Focal Spot X-ray system

Choose processing method

Lapping/polishing	Cutting	Milling	Die bonding	Wire bonding
Polisher/Lapper machine	Wafer Scriber Disco Saw Laser Micromachining Tool	Laser Micromachining Tool Nanotech milling lab	Die Bonder (eutectic metal) Flip-chip Bonder (glue)	TPT Wire Bonder Ball Wire Bonder

Choose material to be processed

Dielectrica	Semiconductors	Metals	Polymers
Borofloat glass (Pyrex) Fused silica (quartz)	Silicon III-V	Aluminium Nickel Steel	PMMA TOPAS Polystyrene Polycarbonate

@@ Line 24: / Line 24: @@
 **[[/Focal Spot X-ray system|Focal Spot X-ray system]]
+== Choose processing method ==
+{| {{table}}
+| align="left" valign="top" style="background:LightGray"|''' Lapping/polishing'''
+| align="left" valign="top"  style="background:LightGray"|''' Cutting'''
+| align="left" valign="top" style="background:#DCDCDC;"|''' Milling'''
+| align="left" valign="top" style="background:LightGray"|''' Die bonding'''
+| align="left" valign="top" style="background:LightGray"|''' Wire bonding'''
+|-valign="top"
+|style="background: LightGray"|
+*[[/Polishing machine|Polisher/Lapper machine]]
+|style="background: LightGray"|
+*[[/Wafer Scriber|Wafer Scriber]]
+*[[/Disco Saw|Disco Saw]]
+*[[/Laser Micromachining Tool|Laser Micromachining Tool]]
+|style="background: LightGray"|
+*[[/Laser Micromachining Tool|Laser Micromachining Tool]]
+*[http://portalen.dtu.dk/Institutter/DTU_Nanotech.aspx Nanotech milling lab]
+|style="background: LightGray"|
+*[[/Die Bonder|Die Bonder (eutectic metal)]]
+*[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]]
+|style="background: LightGray"|
+*[[/Wire Bonder|TPT Wire Bonder]]
+*[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]]
+|-
+|}
 == Choose material to be processed ==
 {| {{table}}