Specific Process Knowledge/Etch/KOH Etch: Difference between revisions

@@ Line 30: / Line 30: @@
-Key facts for the different etch baths available at Danchip are resumed in the table:
+==Quality Control (QC) for the KOH baths.==
+{| border="1" cellspacing="2" cellpadding="2" colspan="3"
+|bgcolor="#98FB98" |'''Quality Control (QC) for KOH1, KOH2 and KOH3'''
+|-
+|
+*[http://labmanager.danchip.dtu.dk/d4Show.php?id=1565&mach=248 The QC procedure for KOH2 and KOH3]<br>
+*[http://labmanager.danchip.dtu.dk/d4Show.php?id=3203&mach=9 The QC procedure for KOH1]<br>
+*[http://www.labmanager.danchip.dtu.dk/view_binary.php?type=data&mach=19 The newest QC data for KOH2]
+{| {{table}}
+| align="center" |
+{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:200px"
+! QC Recipe:
+!
+|-
+| Solution
+|28 wt% KOH
+|-
+|Temperature
+|80°C
+|-
+|Time
+|90 min
+|-
+|Substrate
+|Si (100)
+|-|-
+|Masking
+|No masking
+|-
+|}
+| align="center" valign="top"|
+{| border="3" cellspacing="1" cellpadding="2" align="center" style="width:500px"
+!QC limits
+!KOH1
+!KOH 2&3
+|-
+|Etch rate in Si
+|1.3 ± 0.1 µm/min
+|1.29 ± 0.06 µm/min
+|-
+|Roughness
+| not measured
+|< 80 nm
+|-
+|Nonuniformity
+|< 3%
+|< 3%
+|-
+|}
+|-
+|}
+|}
 <br clear="all" />
 ==KOH etching baths==
+Key facts for the different etch baths available at Danchip are resumed in the table:
 <br clear="all" />