Specific Process Knowledge/Characterization/Topographic measurement: Difference between revisions

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|<1Å - accuracy better than 2%
|<1Å - accuracy better than 2%
|-
|-
|-style="background:LightGrey; color:black"
!'''Resolution xy'''
|down to 0.067 µm
|down to 0.003 µm
|Depending on the objective:
*0.5µm -> 5µm
|Depending on scan size and number of samples per line and number of lines - accuracy better than 2%
|-
|-
|-style="background:WhiteSmoke; color:black"
!'''Max. scan range z'''
|1Å, 10Å, 40Å or 160Å
|1Å, 10Å, 80Å or 160Å
|Depending on measuring methode:
*PSI down to 0.01 nm
*VSI down to 1 nm
*Confocal (depending on objective): 1nm -> 50nm
|<1Å - accuracy better than 2%
|-





Revision as of 15:10, 27 November 2013

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Topographic measurements are measurements were you can measure hight differences on your substrate. If you measure in many spots of the substrate you can get a topographic image of the substrate.

AT DANCHIP we have four systems for topographic measurement:

  • Dektak (there are two systems) - Profiler for measuring micro structures
  • Optical Profiler (Sensofar) - 3D Profiler for measuring micro structures
  • Nanoman - AFM for measuring nano structures

High Aspect ratio structures
The fact that the tips of the Dektak profilers and the AFM are shaped like a cone with some tip angle causes a problem when characterizing high aspect ratio structures. For instance, if a 20 µm wide trench is etched deeper than approximately 18 µm, the tip of the Dektak will not be able to reach the bottom. The optical profiler uses a light beam that is focused through an objective. Therefore it is able to measure higher aspect ratios. The aspect ratio is limited by the posibility for the light to reach the bottom and get back to the detector. On some samples we have been able to measure aspect ratios above 1:10. Otherwise the solution is to cleave the sample along a line that is perpendicular to the trench and then inspect the profile in a scanning electron microscope or a microscope (for large structures).


Comparison of the two profilers and the AFM

Dektak 8 stylus profiler Dektak XTA_new stylus profiler Optical Profiler (Sensofar) Nanoman
General description Profiler for measuring micro structures. Can do wafer mapping and stress measurements. Profiler for measuring micro structures. Can do wafer mapping and stress measurements. 3D Profiler for measuring micro structures. Can do wafer mapping. AFM for measuring nanostructures and surface roughness
Substrate size up to 8" up to 6" Up to more than 6" 6" or less
Max. scan range xy Line scan x: 50µm to 200mm Line scan x: 50µm to 55mm in one scan. Maximum scan lenght with stiching 200mm. Depending on the objective:
  • One view: 127µmX95µm to 1270µmX955µm
  • Stitching: In principel a hole 6" wafer (time consuming)
90 µm square
Max. scan range z 50Å to 1mm 50Å to 1mm Depending on the objective and Z resolution:
  • 94.4µm ->9984µm
1 µm (can go up to 5 µm under special settings)
Resolution xy down to 0.067 µm down to 0.003 µm Depending on the objective:
  • 0.5µm -> 5µm
Depending on scan size and number of samples per line and number of lines - accuracy better than 2%
Resolution z 1Å, 10Å, 40Å or 160Å 1Å, 10Å, 80Å or 160Å Depending on measuring methode:
  • PSI down to 0.01 nm
  • VSI down to 1 nm
  • Confocal (depending on objective): 1nm -> 50nm
<1Å - accuracy better than 2%
Max. scan depth [µm] (as a function of trench width W) 1.2*(W[µm]-5µm) 1.2*(W[µm]-5µm) Depending on material and trench width:
  • Somewhere between 1:1 and 1:12
~1:1 with standard cantilever.
Tip radius 5 µm 45o cone 5 µm 45o cone No tip - using light
  • Blue monochromatic LED: 460nm
  • White broadband LED: 550nm
<12 nm on standard cantilever
Stress measurement Can be done Can be done No stress calculation capability Cannot be done
Surface roughness Can be done on a line scan Can be done on a line scan Can be done on a line or an area Can be done on a selected surface area
Dektak 8 stylus profiler Dektak XTA_new stylus profiler Optical Profiler (Sensofar) Nanoman
Generel description Profiler for measuring micro structures. Can do wafer mapping and stress measurements. Profiler for measuring micro structures. Can do wafer mapping and stress measurements. 3D Profiler for measuring micro structures. Can do wafer mapping. AFM for measuring nanostructures and surface roughness
Max. scan range xy Line scan x: 50µm to 200mm Line scan x: 50µm to 55mm in one scan. Maximum scan lenght with stiching 200mm. Depending on the objective:
  • One view: 127µmX95µm to 1270µmX955µm
  • Stitching: In principel a hole 6" wafer (time consuming)
90 µm square
Max. scan range z 1Å, 10Å, 40Å or 160Å 1Å, 10Å, 80Å or 160Å Depending on measuring methode:
  • PSI down to 0.01 nm
  • VSI down to 1 nm
  • Confocal (depending on objective): 1nm -> 50nm
<1Å - accuracy better than 2%
Resolution xy down to 0.067 µm down to 0.003 µm Depending on the objective:
  • 0.5µm -> 5µm
Depending on scan size and number of samples per line and number of lines - accuracy better than 2%
Max. scan range z 1Å, 10Å, 40Å or 160Å 1Å, 10Å, 80Å or 160Å Depending on measuring methode:
  • PSI down to 0.01 nm
  • VSI down to 1 nm
  • Confocal (depending on objective): 1nm -> 50nm
<1Å - accuracy better than 2%
Substrate size
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
Allowed materials
  • Allowed material 1
  • Allowed material 2
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3