Specific Process Knowledge/Characterization/Topographic measurement: Difference between revisions
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|Can be done on a selected surface area | |Can be done on a selected surface area | ||
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![[Specific Process Knowledge/Characterization/Profiler#Dektak_8_stylus_profiler|Dektak 8 stylus profiler]] | |||
![[Specific Process Knowledge/Characterization/Profiler#Dektak XTA_new_stylus_profiler|Dektak XTA_new stylus profiler]] | |||
![[Specific Process Knowledge/Characterization/Profiler#Optical_Profiler_(Sensofar)|Optical Profiler (Sensofar)]] | |||
![[Specific Process Knowledge/Characterization/AFM: Atomic Force Microscopy|Nanoman]] | |||
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!Generel description | |||
|Profiler for measuring micro structures. Can do wafer mapping and stress measurements. | |||
|Profiler for measuring micro structures. Can do wafer mapping and stress measurements. | |||
|3D Profiler for measuring micro structures. Can do wafer mapping. | |||
|AFM for measuring nanostructures and surface roughness | |||
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|-style="background:LightGrey; color:black" | |||
!'''Max. scan range xy''' | |||
|Line scan x: 50µm to 200mm | |||
|Line scan x: 50µm to 55mm in one scan. Maximum scan lenght with stiching 200mm. | |||
|Depending on the objective: | |||
*One view: 127µmX95µm to 1270µmX955µm | |||
*Stitching: In principel a hole 6" wafer (time consuming) | |||
|90 µm square | |||
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!'''Max. scan range z''' | |||
|1Å, 10Å, 40Å or 160Å | |||
|1Å, 10Å, 80Å or 160Å | |||
|Depending on measuring methode: | |||
*PSI down to 0.01 nm | |||
*VSI down to 1 nm | |||
*Confocal (depending on objective): 1nm -> 50nm | |||
|<1Å - accuracy better than 2% | |||
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!Substrate size | |||
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*<nowiki>#</nowiki> small samples | |||
*<nowiki>#</nowiki> 50 mm wafers | |||
*<nowiki>#</nowiki> 100 mm wafers | |||
*<nowiki>#</nowiki> 150 mm wafers | |||
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*<nowiki>#</nowiki> small samples | |||
*<nowiki>#</nowiki> 50 mm wafers | |||
*<nowiki>#</nowiki> 100 mm wafers | |||
*<nowiki>#</nowiki> 150 mm wafers | |||
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!'''Allowed materials''' | |||
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*Allowed material 1 | |||
*Allowed material 2 | |||
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*Allowed material 1 | |||
*Allowed material 2 | |||
*Allowed material 3 | |||
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