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Specific Process Knowledge/Bonding: Difference between revisions

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|'''Bonding temperature'''
|'''Bonding temperature'''
|Depending on the eutecticum 310<math>^o</math>C to 400<math>^o</math>C.
|Depending on the eutecticum 310°C  to 400°C .
|Depending on defects 50<math>^o</math>C to 400<math>^o</math>C.
|Depending on defects 50°C  to 400°C .
|Depending on the voltage 300<math>^o</math>C to 500<math>^o</math>C Standard is 400<math>^o</math>C.
|Depending on the voltage 300°C to 500°C  Standard is 400°C .
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|'''Annnealing temperature'''
|'''Annnealing temperature'''
|No annealing
|No annealing
|1000<math>^o</math>C in the bond furnace C3  
|1000°C  in the bond furnace C3  
|No annealing
|No annealing
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