Specific Process Knowledge/Characterization/Profiler: Difference between revisions

← Older edit Newer edit →

VisualWikitext

@@ Line 13: / Line 13: @@
 |-
 !style="background:silver; color:black;" align="left"|Purpose
-|style="background:LightGrey; color:black"|Profiler for measuring micro structures. Can do wafer mapping and stress measurements.||style="background:WhiteSmoke; color:black"|
+|style="background:LightGrey; color:black"|Profiler for measuring micro structures.||style="background:WhiteSmoke; color:black"|
 *Single point profiles
 *Wafer mapping
 *Stress measurements by measuring wafer bow
+*Surface roughness on a line scan
 |-
 !style="background:silver; color:black" align="left"|Performance
 |style="background:LightGrey; color:black"|Scan range xy||style="background:WhiteSmoke; color:black"|
-Any film that is transparent to the light in the given wavelength range
 Line scan x: 50 µm to 200 mm
 |-
@@ Line 43: / Line 43: @@
 |style="background:LightGrey; color:black"|Tip radius
 |style="background:WhiteSmoke; color:black"|
-*5 µm 60<sup>o</sup> cone
+*5 µm 45<sup>o</sup> cone
 |-
 !style="background:silver; color:black" align="left"|Substrates
@@ Line 61: / Line 61: @@
 ==Tencor stylus profiler==
+[[image:TencorP1.jpg|275x275px|right|thumb|Tencor: positioned in cleanroom 4 - glass cage no. 3]]
+Tencor P1 stylus profiler is a product of KLA-Tencor Corporation. It is usable for profiling surfaces of samples with structures in the micrometer range. It can measure in a specific point found with help from a high magnification video camera. It can also be used for stress measurements of thin films by measuring the wafer bow.
+It is a very old system and should be treated with care.
+<br clear="all" />
+===A rough overview of the performance of Tencor P1 stylus profiler===
+{| border="2" cellspacing="0" cellpadding="10"
+|-
+!style="background:silver; color:black;" align="left"|Purpose
+|style="background:LightGrey; color:black"|Profiler for measuring micro structures. ||style="background:WhiteSmoke; color:black"|
+*Single point profiles
+*Stress measurements by measuring wafer bow
+*Surface roughness on a line scan
+|-
+!style="background:silver; color:black" align="left"|Performance
+|style="background:LightGrey; color:black"|Scan range xy||style="background:WhiteSmoke; color:black"|
+Line scan x: Full substrate size
+|-
+|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Scan range z
+|style="background:WhiteSmoke; color:black"|
+<100 Å to ~0.3 mm
+|-
+|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Resolution xy
+|style="background:WhiteSmoke; color:black"|
+up to 5900 data points per profile
+|-
+|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Resolution z
+|style="background:WhiteSmoke; color:black"|
+Å or 25Å
+|-
+|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Max. scan depth as a function of trench width W
+|style="background:WhiteSmoke; color:black"|
+.87(W[µm]-5µm)
+|-
+|-
+!style="background:silver; color:black" align="left"|Hardware settings
+|style="background:LightGrey; color:black"|Tip radius
+|style="background:WhiteSmoke; color:black"|
+*5 µm 60<sup>o</sup> cone
+|-
+!style="background:silver; color:black" align="left"|Substrates
+|style="background:LightGrey; color:black"|Substrate size
+|style="background:WhiteSmoke; color:black"|
+*up to 4"
+|-
+|style="background:silver; color:black"|.|| style="background:LightGrey; color:black"|Substrate material allowed
+|style="background:WhiteSmoke; color:black"|
+*In principle all materials
+|-
+|}
+<br clear="all" />
+==Comparing the profilers==
+Take a look at the [[Specific Process Knowledge/Characterization/Topographic measurement|topographic measurement]] page.