Specific Process Knowledge/Characterization/Profiler: Difference between revisions

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!style="background:silver; color:black;" align="left"|Purpose  
!style="background:silver; color:black;" align="left"|Purpose  
|style="background:LightGrey; color:black"|Film thickness measurements and optical characterization of optically transparent thin films||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Profiler for measuring micro structures. Can do wafer mapping and stress measurements.||style="background:WhiteSmoke; color:black"|
*Measurement of (multi layer) film thickness (only one unknown layer)
*Single point profiles
*Optical constants
*Wafer mapping
*Stress measurements by measuring wafer bow
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!style="background:silver; color:black" align="left"|Performance
!style="background:silver; color:black" align="left"|Performance
|style="background:LightGrey; color:black"|Thin film materials that can be measured||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Scan range xy||style="background:WhiteSmoke; color:black"|
Any film that is transparent to the light in the given wavelength range
Any film that is transparent to the light in the given wavelength range
ex:
Line scan x: 50 µm to 200 mm
*Silicon Oxide
*Silicon nitride
*PolySilicon
*Photoresists
*SU8
*Other polymers
*Very thin layers of metals (<20 nm)
*and many more
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|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Film thickness range
|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Scan range z
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*~20Å to 2 µm (depending of the material)
50 Å to 262 µm
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!style="background:silver; color:black" align="left"|Process parameter range
|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Resolution xy
|style="background:LightGrey; color:black"|Wavelength range
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*300-950 nm
down to 0.067 µm
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|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Resolution z
|style="background:WhiteSmoke; color:black"|
1Å, 10Å or 20Å
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|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Max. scan depth as a function of trench width W
|style="background:WhiteSmoke; color:black"|
1.2(W[µm]-5µm)
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!style="background:silver; color:black" align="left"|Hardware settings
|style="background:LightGrey; color:black"|Tip radius
|style="background:WhiteSmoke; color:black"|
*5 µm 60<sup>o</sup> cone
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!style="background:silver; color:black" align="left"|Substrates
!style="background:silver; color:black" align="left"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*One sample at a time - all sample larger than  about 1x1 cm<sup>2</sup>sizes up to about 6"
*up to 8"
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|style="background:silver; color:black"|.|| style="background:LightGrey; color:black"|Substrate material allowed
|style="background:silver; color:black"|.|| style="background:LightGrey; color:black"|Substrate material allowed

Revision as of 11:09, 7 January 2008

Dektak 8 stylus profiler

Dektak8: positioned in cleanroom 4 - glass cage no. 3

Dektak 8 stylus profiler is a product of Veeco Instruments. It is usable for profiling surfaces of samples with structures in the micrometer range. It can measure in a specific point found with help from high magnification video cameras or it can be programmed to measure several points defined with respect to some deskew points. It can also be used for stress measurements of thin films by measuring the wafer bow.

To get some product information and some tips and tricks from the vendor take a look at Veeco's homepage [1]

A rough overview of the performance of Dektak 8 stylus profiler

Purpose Profiler for measuring micro structures. Can do wafer mapping and stress measurements.
  • Single point profiles
  • Wafer mapping
  • Stress measurements by measuring wafer bow
Performance Scan range xy

Any film that is transparent to the light in the given wavelength range Line scan x: 50 µm to 200 mm

. Scan range z

50 Å to 262 µm

. Resolution xy

down to 0.067 µm

. Resolution z

1Å, 10Å or 20Å

. Max. scan depth as a function of trench width W

1.2(W[µm]-5µm)

Hardware settings Tip radius
  • 5 µm 60o cone
Substrates Substrate size
  • up to 8"
. Substrate material allowed
  • In principle all materials



Tencor stylus profiler