Specific Process Knowledge/Etch/Etching of SU-8: Difference between revisions
| Line 76: | Line 76: | ||
|Etch | |Etch | ||
*O<sub>2</sub> flow [sccm]:99 | *O<sub>2</sub> flow [sccm]:99 | ||
*SF<sub>6</sub> flow [sccm]: | *SF<sub>6</sub> flow [sccm]:17 | ||
*Pressure [mTorr]: | *Pressure [mTorr]:40 | ||
*Coil power [W]:800 | *Coil power [W]:800 | ||
*Platen power [W]:30 | *Platen power [W]:30 | ||
*Temperature [°C]: | *Temperature [°C]:30 | ||
|Etch | |Etch | ||
*O<sub>2</sub> flow [sccm]:99 | *O<sub>2</sub> flow [sccm]:99 | ||
*SF<sub>6</sub> flow [sccm]: | *SF<sub>6</sub> flow [sccm]:14 | ||
*Pressure [mTorr]:20 | *Pressure [mTorr]:20 | ||
*Coil power [W]:800 | *Coil power [W]:800 | ||
*Platen power [W]: | *Platen power [W]:0 | ||
*Temperature [°C]:10 | *Temperature [°C]:10 | ||
|} | |} | ||