Specific Process Knowledge/Characterization/Sample imaging: Difference between revisions

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 !'''Allowed materials'''
 |
-*Silicon,silion oxide, silicon nitride
+*All sample materials (non-contact measurements)
-*Quartz, polymers and photoresist
-*Metals (except type IV)
-*III-V materials
-*Graphene and carbon nanotubes
 |
-*Silicon,silion oxide, silicon nitride
+*All sample materials (non-contact measurements)
-*Quartz, glass
-*Polymers and photoresist
-*Metals (except type IV)
-*III-V materials
-*Graphene and carbon nanotubes
 |
-*Silicon,silion oxide, silicon nitride
+*All sample materials, expect:
-*Quartz, glass
+Samples that may disintegrate, produce dust/particles or degas (e.g. wet polymers and powders. Samples with resist or polymer should be properly baked and outgassed before SEM inspection
-*polymers and photoresist (outbaked)
-*Metals (except type IV)
-*III-V materials
 *Graphene and carbon nanotubes
 :(Only FEI, use special sample holder)
 |
-*Silicon,silion oxide, silicon nitride
+*All sample materials, except samples that might stick to the tip.
-*Quartz, glass
-*Polymers and photoresist
-*Metals (except type IV)
-*III-V materials
-*Graphene and carbon nanotubes
 |
-*Silicon,silion oxide, silicon nitride
+*All sample materials, expect samples that might stick to the tip.
-*Quartz, glass
+*III-V samples:
-*Polymers and photoresist
+:(Use the III-V profiler)
-*Metals (except type IV)
-*III-V materials
-*Graphene and carbon nanotubes
 |-
 |}