Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE Au etch: Difference between revisions
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<gallery widths="150px" heights="150px" perrow="3" > | <gallery caption="Ti mask etched for 6min30sec with recipe ''test Ti acceptance 20111129'' - The Au was etched for 7min with recipe ''Au_acceptance_with_O2''. The result was less fenching because a thinner mask was used (Ti instead off resist)" widths="150px" heights="150px" perrow="3" > | ||
image:IBE_Au_Ti_w14_20130926_500nmT_BHF5min_2.jpg|Tilted line in Au after Ti has been removed. | image:IBE_Au_Ti_w14_20130926_500nmT_BHF5min_2.jpg|Tilted line in Au after Ti has been removed. | ||
image:IBE_Au_Ti_W14_20130926_500nm_1.jpg|Profile in Au after Ti has been removed. | image:IBE_Au_Ti_W14_20130926_500nm_1.jpg|Profile in Au after Ti has been removed. | ||