Specific Process Knowledge/Imprinting: Difference between revisions
No edit summary |
No edit summary |
||
| Line 1: | Line 1: | ||
'''Feedback to this page''': '''[mailto:photolith@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Imprinting click here]''' | |||
==Imprinting== | ==Imprinting== | ||
Imprinting (hot embossing) is a parallel transfer of a pattern made by a serial technique (often e-beam). First a stamp is made, usually in Si or SiO<math>\rm{_2}</math> however other materials could also be used. The pattern on the stamp is then transferred to a polymer (on a different substrate), by heating both stamp and substrate to above the glass transition temperature T<math>_g</math> of the polymer and then pressing the stamp and the substrate together, hence deforming the polymer on the substrate. The stamp and substrate are then cooled down and only separated when the temperature is well bellow T<math>_g</math> of the polymer. Normally the stack is often cooled to room temperature to easily separate the two parts. | Imprinting (hot embossing) is a parallel transfer of a pattern made by a serial technique (often e-beam). First a stamp is made, usually in Si or SiO<math>\rm{_2}</math> however other materials could also be used. The pattern on the stamp is then transferred to a polymer (on a different substrate), by heating both stamp and substrate to above the glass transition temperature T<math>_g</math> of the polymer and then pressing the stamp and the substrate together, hence deforming the polymer on the substrate. The stamp and substrate are then cooled down and only separated when the temperature is well bellow T<math>_g</math> of the polymer. Normally the stack is often cooled to room temperature to easily separate the two parts. | ||