Specific Process Knowledge/Thin film deposition: Difference between revisions

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 *[[/Furnace LPCVD TEOS|Furnace LPCVD TEOS (4")]] - ''Deposition of silicon oxide''
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-[[/Deposition of Aluminium|Aluminium]] <br/>
+*[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition''
-[[/Deposition of Titanium|Titanium]]<br/>
-[[/Deposition of Chromium|Chromium]]<br/>
-[[/Deposition of Nickel|Nickel]]<br/>
-[[/Deposition of Copper|Copper]]<br/>
-[[/Deposition of Germanium|Germanium]]<br/>
-[[/Deposition of Molybdenum|Molybdenum]]<br/>
-[[/Deposition of Palladium|Palladium]]<br/>
-[[/Deposition of Silver|Silver]]<br/>
-[[/Deposition of Tin|Tin]]<br/>
-[[/Deposition of Tantalum|Tantalum]]<br/>
-[[/Deposition of Tungsten|Tungsten]]<br/>
-[[/Deposition of Platinum|Platinum]]<br/>
-[[/Deposition of Gold|Gold]]<br/>
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 [[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/>