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Specific Process Knowledge/Thin film deposition: Difference between revisions

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[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride'' <br/>
*[[/Alcatel|Alcatel]] - ''E-beam evaporator and sputter tool''
[[/Deposition of Silicon Oxide|Silicon Oxide]]<br/>
*[[/Lesker|Lesker]] - ''Sputter tool''
[[/Deposition of Titanium Oxide|Titanium Oxide]]<br/>
*[[/Multisource_PVD|PVD co-sputter/evaporation]] - ''E-beam evaporator and multiple wafer tool''
*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator''
*[[Specific Process Knowledge/III-V Process/thin film dep/physimeca|Physimeca]] - ''E-beam evaporator (III-V lab)''
*[[Specific Process Knowledge/Etch/IBE&frasl;IBSD Ionfab 300|IBE/IBSD Ionfab 300]] - ''Sputter deposition of high quality optical layers and milling/etching''
*[[/Hummer|Hummer]] - ''Gold sputtering system''
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[[/Deposition of Silicon|Silicon]]
[[/Deposition of Silicon|Silicon]]