Specific Process Knowledge/Thin film deposition: Difference between revisions
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[[/ | *[[/Alcatel|Alcatel]] - ''E-beam evaporator and sputter tool'' | ||
[[/ | *[[/Lesker|Lesker]] - ''Sputter tool'' | ||
[[/ | *[[/Multisource_PVD|PVD co-sputter/evaporation]] - ''E-beam evaporator and multiple wafer tool'' | ||
*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator'' | |||
*[[Specific Process Knowledge/III-V Process/thin film dep/physimeca|Physimeca]] - ''E-beam evaporator (III-V lab)'' | |||
*[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] - ''Sputter deposition of high quality optical layers and milling/etching'' | |||
*[[/Hummer|Hummer]] - ''Gold sputtering system'' | |||
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[[/Deposition of Silicon|Silicon]] | [[/Deposition of Silicon|Silicon]] | ||