Specific Process Knowledge/Etch: Difference between revisions

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 [[/Deposition of Silicon|Silicon]]
 |style="background: LightGray"|
-[[/Deposition of Aluminium|Aluminium]] <br/>
+*[[/Etching of Aluminium|Aluminium]]
-[[/Deposition of Titanium|Titanium]]<br/>
+*[[/Etching of Chromium|Chromium]]
-[[/Deposition of Chromium|Chromium]]<br/>
+*[[/Etching of Titanium|Titanium]]
-[[/Deposition of Nickel|Nickel]]<br/>
+*[[/Etching of Gold|Gold]]
-[[/Deposition of Copper|Copper]]<br/>
+*[[/Etching of Platinum|Platinum]]
-[[/Deposition of Germanium|Germanium]]<br/>
+*[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE magnetic stack etch|Magnetic stack]] - ''containing Ta/MnIr/NiFe''
-[[/Deposition of Molybdenum|Molybdenum]]<br/>
-[[/Deposition of Palladium|Palladium]]<br/>
-[[/Deposition of Silver|Silver]]<br/>
-[[/Deposition of Tin|Tin]]<br/>
-[[/Deposition of Tantalum|Tantalum]]<br/>
-[[/Deposition of Tungsten|Tungsten]]<br/>
-[[/Deposition of Platinum|Platinum]]<br/>
-[[/Deposition of Gold|Gold]]<br/>
 |style="background: #DCDCDC"|
 [[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/>