Specific Process Knowledge/Thin film deposition: Difference between revisions
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[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride'' <br/> | [[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride'' <br/> | ||
[[/Deposition of Silicon Oxide|Silicon Oxide]]<br/> | [[/Deposition of Silicon Oxide|Silicon Oxide]]<br/> | ||
[[/Deposition of Titanium Oxide|Titanium Oxide]]<br/> | [[/Deposition of Titanium Oxide|Titanium Oxide]]<br/> | ||
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[[/Deposition of Silicon|Silicon]] | |||
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[[/Deposition of Aluminium|Aluminium]] <br/> | [[/Deposition of Aluminium|Aluminium]] <br/> | ||
[[/Deposition of Titanium|Titanium]]<br/> | [[/Deposition of Titanium|Titanium]]<br/> | ||
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[[/Deposition of Platinum|Platinum]]<br/> | [[/Deposition of Platinum|Platinum]]<br/> | ||
[[/Deposition of Gold|Gold]]<br/> | [[/Deposition of Gold|Gold]]<br/> | ||
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[[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/> | [[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/> | ||
[[/Deposition of NiCr|NiCr]] alloy <br/> | [[/Deposition of NiCr|NiCr]] alloy <br/> | ||
[[/Deposition of AlTi|AlTi]] alloy | [[/Deposition of AlTi|AlTi]] alloy | ||
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[[Specific Process Knowledge/Photolithography/SU8|SU8]]<br/> | [[Specific Process Knowledge/Photolithography/SU8|SU8]]<br/> | ||
Antistiction coating <br/> | Antistiction coating <br/> | ||
Revision as of 14:59, 14 October 2013
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Choose material to deposit
Dielectrica
- Silicon Nitride - Silicon nitride and silicon oxynitride
- Silicon Oxide
- Titanium Oxide
Metals/elements
|
Period/Group |
IVB | VB | VIB | VIIIB | IB | IIIA | IVA |
| 3 | . | . | . | . | . | 13 Al Aluminium | 14 Si Silicon |
| 4 | 22 Ti Titanium | . | 24 Cr Chromium | 28 Ni Nickel | 29 Cu Copper | . | 32 Ge Germanium |
| 5 | . | . | 42 Mo Molybdenum | 46 Pd Palladium | 47 Ag Silver | . | 50 Sn Tin |
| 6 | . | 73 Ta Tantalum | 74 W Tungsten | 78 Pt Platinum | 79 Au Gold | . | . |
Alloys
Polymers
- SU8
- Antistiction coating
- Topas
- PMMA
Choose deposition equipment
- Alcatel - E-beam evaporator and sputter tool
- Lesker - Sputter tool
- PVD co-sputter/evaporation - E-beam evaporator and multiple wafer tool
- Wordentec - E-beam evaporator, sputter and thermal evaporator
- Physimeca - E-beam evaporator (III-V lab)
- IBE/IBSD Ionfab 300 - Sputter deposition of high quality optical layers and milling/etching
- Hummer - Gold sputtering system
- PECVD - Plasma Enhanced Chemical Vapor deposition
- Furnace LPCVD Nitride (4" and 6") - Deposition of silicon nitride
- Furnace LPCVD Polysilicon (4" and 6") - Deposition of polysilicon
- Furnace LPCVD TEOS (4") - Deposition of silicon oxide
- MVD - Molecular Vapor Deposition
- Black Magic PECVD - Black Magic PECVD (Carbon)
- Electroplating-Ni - Electrochemical deposition of nickel
Section under construction 
| Dielectrica | Semicondutors | Metals | Alloys | Polymers |
|
Silicon Nitride - and oxynitride |
Aluminium |
SU8 |