Specific Process Knowledge/Thin film deposition: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,018 edits
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===Semiconductors===
===Semiconductors===
*[[Specific Process Knowledge/Lithography/DUVStepper#SÜSS Spinner-Stepper|SÜSS Spinner-Stepper]]
*[[Specific Process Knowledge/Lithography/DUVStepper#SÜSS Spinner-Stepper|SÜSS Spinner-Stepper]]
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===Metals===
===Metals===
*[[Specific Process Knowledge/Lithography/EBeamLithography#Performance of the e-beam writer|Performance]]
*[[Specific Process Knowledge/Lithography/EBeamLithography#Performance of the e-beam writer|Performance]]
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*[[Specific Process Knowledge/Lithography/EBeamLithography#Charging of non-conductive substrates|Charging of non-conductive substrates]]
*[[Specific Process Knowledge/Lithography/EBeamLithography#Charging of non-conductive substrates|Charging of non-conductive substrates]]
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===Alloys===
===Alloys===
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*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|EVG NIL]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|EVG NIL]]
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===Polymers===
===Polymers===

Revision as of 13:24, 14 October 2013

3rd Level - Material/Methode

Feedback to this page: click here


Choose material to deposit

Dielectrica

Metals/elements

Period/Group

IVB VB VIB VIIIB IB IIIA IVA
3 . . . . . 13 Al Aluminium 14 Si Silicon
4 22 Ti Titanium . 24 Cr Chromium 28 Ni Nickel 29 Cu Copper . 32 Ge Germanium
5 . . 42 Mo Molybdenum 46 Pd Palladium 47 Ag Silver . 50 Sn Tin
6 . 73 Ta Tantalum 74 W Tungsten 78 Pt Platinum 79 Au Gold . .

Alloys


Polymers

  • SU8
  • Antistiction coating
  • Topas
  • PMMA

Choose deposition equipment


Section under construction


Dielectrica

Semiconductors

Metals

Alloys

Polymers

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