Revision as of 12:50, 14 October 2013

3rd Level - Material/Methode

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Choose material to deposit

Dielectrica

Silicon Nitride - Silicon nitride and silicon oxynitride
Silicon Oxide
Titanium Oxide

Metals/elements

Period/Group	IVB	VB	VIB	VIIIB	IB	IIIA	IVA
3	.	.	.	.	.	13 Al Aluminium	14 Si Silicon
4	22 Ti Titanium	.	24 Cr Chromium	28 Ni Nickel	29 Cu Copper	.	32 Ge Germanium
5	.	.	42 Mo Molybdenum	46 Pd Palladium	47 Ag Silver	.	50 Sn Tin
6	.	73 Ta Tantalum	74 W Tungsten	78 Pt Platinum	79 Au Gold	.	.

Alloys

TiW alloy (10%/90% by weight)
NiCr alloy
AlTi alloy

Polymers

SU8
Antistiction coating
Topas
PMMA

Choose deposition equipment

Alcatel - E-beam evaporator and sputter tool
Lesker - Sputter tool
PVD co-sputter/evaporation - E-beam evaporator and multiple wafer tool
Wordentec - E-beam evaporator, sputter and thermal evaporator
Physimeca - E-beam evaporator (III-V lab)
IBE/IBSD Ionfab 300 - Sputter deposition of high quality optical layers and milling/etching
Hummer - Gold sputtering system
PECVD - Plasma Enhanced Chemical Vapor deposition
Furnace LPCVD Nitride (4" and 6") - Deposition of silicon nitride
Furnace LPCVD Polysilicon (4" and 6") - Deposition of polysilicon
Furnace LPCVD TEOS (4") - Deposition of silicon oxide
MVD - Molecular Vapor Deposition
Black Magic PECVD - Black Magic PECVD (Carbon)
Electroplating-Ni - Electrochemical deposition of nickel

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 |-
-| style="width: 40%"|
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+{| style="color: black;" width="20%"
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+|-
-==Dielectrica==
+===Dielectrica===
-===[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]===
 *[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
 *[[Specific Process Knowledge/Lithography/Pretreatment#BHF|BHF]]
 *[[Specific Process Knowledge/Lithography/Pretreatment#250_C_oven_for_pretreatment|250C Oven for Pretreatment]]
-===[[Specific Process Knowledge/Lithography/Coaters|Coaters]]===
 *[[Specific Process Knowledge/Lithography/Coaters#SSE Spinner|SSE Spinner]]
 *[[Specific Process Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]
@@ Line 120: / Line 133: @@
 *[[Specific Process Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]]
 *[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]]
-===[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure]]===
 *[[Specific Process Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]]
 *[[Specific Process Knowledge/Lithography/UVExposure#Aligner-6inch|Aligner-6inch]]
 *[[Specific Process Knowledge/Lithography/UVExposure#III-V Aligner|III-V Aligner]]
 *[[Specific Process Knowledge/Lithography/UVExposure#Inclined UV lamp|Inclined UV lamp]]
-| style="width: 40%"|
-===[[Specific Process Knowledge/Lithography/Baking|Baking]]===
 *[[Specific Process Knowledge/Lithography/Baking#Hotplates|Hotplates]]
 *[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]
-===[[Specific Process Knowledge/Lithography/Development|Development]]===
 *[[Specific Process Knowledge/Lithography/Development#Automatic Developer Bench for 4" and 6"|Developer Bench]]
-===[[Specific Process Knowledge/Lithography/Strip|Strip]]===
 *[[Specific Process Knowledge/Lithography/Strip#Plasma Asher 1|Plasma Asher 1]]
 *[[Specific Process Knowledge/Lithography/Strip#Plasma Asher 2|Plasma Asher 2]]
@@ Line 142: / Line 149: @@
 *[[Specific Process Knowledge/Lithography/Strip#Fine Acetone Strip|Fine Acetone Strip]]
-===[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]===
 *[[Specific Process Knowledge/Lithography/LiftOff#LiftOffWetBench|Lift-off Wet Bench]]
 *[[Specific Process Knowledge/Lithography/LiftOff#LiftOff(4",6")|Lift-off (4", 6")]]
-===[[Specific Process Knowledge/Lithography/WaferCleaning|Wafer Cleaning]]===
 *[[Specific Process Knowledge/Lithography/WaferCleaning#Spindryers|Spin dryers]]
 |}
-| style="width: 50%"|
+| style="width: 20%"|
-==Semiconductors==
+===Semiconductors===
 *[[Specific Process Knowledge/Lithography/DUVStepper#SÜSS Spinner-Stepper|SÜSS Spinner-Stepper]]
 *[[Specific Process Knowledge/Lithography/DUVStepper#Process information|Process information]]
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 *[[Specific Process Knowledge/Lithography/DUVStepper#Process information|Process information]]
 *[[Specific Process Knowledge/Lithography/DUVStepper#Overview of performance|Overview of performance]]
+|}
+| style="width: 50%"|
-==Metals==
+===Metals===
 *[[Specific Process Knowledge/Lithography/EBeamLithography#Performance of the e-beam writer|Performance]]
 *[[Specific Process Knowledge/Lithography/EBeamLithography#Getting started|Getting started]]
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 *[[Specific Process Knowledge/Lithography/EBeamLithography#Proximity Error Correction|Proximity Error Correction]]
 *[[Specific Process Knowledge/Lithography/EBeamLithography#Charging of non-conductive substrates|Charging of non-conductive substrates]]
+|}
+| style="width: 50%"|
-==Alloys==
+===Alloys===
 *[[Specific Process Knowledge/Lithography/NanoImprintLithography#Molecular Vapour Deposition|Molecular Vapour Deposition]]
 *[[Specific Process Knowledge/Lithography/NanoImprintLithography#ObducatNIL|Obducat NIL]]
 *[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|EVG NIL]]
+|}
+| style="width: 50%"|
-==Polymers==
+===Polymers===
 *[[Specific Process Knowledge/Lithography/3DLithography#2-Photon Polymerization|2-Photon Polymerization]]
 |}

Specific Process Knowledge/Thin film deposition: Difference between revisions

Revision as of 12:50, 14 October 2013

Choose material to deposit

Dielectrica

Metals/elements

Alloys

Polymers

Choose deposition equipment

Section under construction

Dielectrica

Semiconductors

Metals

Alloys

Polymers