Specific Process Knowledge/Wafer cleaning: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning click here]''' | |||
== Clean with: == | == Clean with: == | ||
Revision as of 13:54, 11 October 2013
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Clean with:
- RCA - Two step process to remove organics and metals
- 7-up & Piranha - Removes organics and alkali ions
- 5% HF - Removing native oxide
- IMEC - Cleaning before fusion bonding
- Soap Sonic - Cleaning of "dirty" wafers when entering the cleanroom